Thermal Epoxy Heat Sink

Primarily used for bonding of heat sinks and sensors where heat transfer is desirable.

Thermal epoxy heat sink. Serviceable from 4k to 400 f. One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. These thermal tapes provide excellent long term reliability electrical insulation and flame retardant performance. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications.

One part oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. The 70 3812nc aluminum filled epoxy adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds. The liqui bond product line also offers mild elastic properties which assist in relieving cte mismatches. This range of high adhesion thin thermal tapes offers bonding strength and efficient heat dissipation for applications such as heat sink mounting and led lighting thermal management.

3m thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications. 50 3186 nc is a two part thermally conductive epoxy adhesive. 50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance. These customizable liquid tapes pads or a mix means reliable high thermal performance less waste and just in time supply.

Henkel thermal adhesives create a mechanical attachment of a component to a heat sink with thermal transfer properties and without the need for additional fasteners.